AMC1300DWVR New & Original DC To DC Converter & Switching Regulator Chip

short description:

The AMC1300 is an isolated precision amplifier whose output is separated from the input circuitry by an isolation barrier that is highly resistant to electromagnetic interference. The isolation barrier is certified to provide reinforced galvanic isolation up to 5kVRMS according to VDE V 0884-11 and UL1577 standards. When used in conjunction with an isolated power supply, the isolation amplifier isolates components of a system that operate at different common-mode voltage levels and prevents damage to lower voltage components.

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Product Detail

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Product Attributes

TYPE	ILLUSTRATE
category	Integrated Circuits (ICs) Linear amplifier Special purpose amplifiers
manufacturer	Texas Instruments
series	-
wrap	Tape and rolling packages (TR) Insulating tape package (CT) Digi-Reel®
Product status	Active
type	Isolated
apply	Current sensing, power management
Installation type	Surface adhesive type
Package/Housing	8-SOIC (0.295", 7.50mm width)
Vendor component encapsulation	8-SOIC
Product master number	AMC1300

Detailed Introduction

AMC1301DWVR INTERGRATED CIRCUIT IC CHIP (2)

According to its manufacturing process, integrated circuits can be divided into semiconductor integrated circuits, thin film integrated circuits and hybrid integrated circuits. Semiconductor integrated circuit is an integrated circuit made on silicon substrate using semiconductor technology, including resistor, capacitor, transistor, diode and other components, with a certain circuit function; Thin film integrated circuits (MMIC) are passive components such as resistors and capacitors made in the form of thin films on insulating materials such as glass and ceramics.

Passive components have a wide range of values and high precision. However, it is not possible to make active devices such as crystal diodes and transistors into thin films, which limits the application of thin film integrated circuits.

In practical applications, most passive thin film circuits are composed of semiconductor integrated circuits or active components such as diodes and triodes, which are called hybrid integrated circuits. Thin film integrated circuits are divided into thick film integrated circuits (1μm ~ 10μm) and thin film integrated circuits (less than 1μm) according to the film thickness. Semiconductor integrated circuits, thick film circuits and a small amount of hybrid integrated circuits mainly appear in household appliance maintenance and general electronic manufacturing process.
According to the level of integration, it can be divided into small integrated circuit, medium integrated circuit, large integrated circuit and large scale integrated circuit.

For analog integrated circuits, due to high technical requirements and complex circuits, it is generally considered that the integrated circuit with less than 50 components is a small integrated circuit, the integrated circuit with 50-100 components is a medium integrated circuit, and the integrated circuit with more than 100 components is a large-scale integrated circuit. For digital integrated circuits, it is generally considered that the integration of 1-10 equivalent gates/chips or 10-100 components/chips is small integrated circuit, and the integration of 10-100 equivalent gates/chips or 100-1000 components/chips is medium integrated circuit. The integration of 100-10,000 equivalent gates/chips or 1000-100,000 components/chips is a large-scale integrated circuit that integrates more than 10,000 equivalent gates/chips or 100 components/chips, and more than 2,000 components/chips are VLSI.

According to conduction type can be divided into bipolar integrated circuit and unipolar integrated circuit. The former has good frequency characteristics, but high power consumption and complex manufacturing process. The TTL, ECL, HTL, LSTTL, and STTL types in most analog and digital integrated circuits fall into this category. The latter works slowly, but the input impedance is high, the power consumption is low, the production process is simple, easy to large-scale integration. The main products are MOS integrated circuits. The MOS circuit is separate

The Classification Of The IC

Integrated circuits can be classified into analog or digital circuits. They can be divided into analog integrated circuits, digital integrated circuits and mixed-signal integrated circuits (analog and digital on one chip).

Digital integrated circuits can contain anything from thousands to millions of logic gates, triggers, multitaskers and other circuits in a few square millimeters. The small size of these circuits allows for higher speeds, lower power consumption and lower manufacturing costs compared to board-level integration. These digital ics, represented by microprocessors, digital signal processors (DSP) and microcontrollers, work using binary, processing 1 and 0 signals.

Analog integrated circuits, such as sensors, power control circuits and operational amplifiers, process analog signals. Complete amplification, filtering, demodulation, mixing and other functions. By using analog integrated circuits designed by experts with good characteristics, it relieves circuit designers of the burden of designing from the base of transistors.

IC can integrate analog and digital circuits on A single chip to make devices such as analog to Digital converter (A/D Converter) and digital to analog converter (D/A Converter). This circuit offers smaller size and lower cost, but must be careful about signal collisions.