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Factory directly supply Timer Integrated Circuit - Hot offer Ic chip (Electronic Components IC Semiconductor chip ) XAZU3EG-1SFVC784I – Yingnuode

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Factory directly supply Timer Integrated Circuit - Hot offer Ic chip (Electronic Components IC Semiconductor chip ) XAZU3EG-1SFVC784I – Yingnuode Detail:

Product Attributes

TYPE DESCRIPTION

SELECT

Category Integrated Circuits (ICs)

Embedded

System On Chip (SoC)

 

 

 

Mfr AMD Xilinx

 

Series Zynq® UltraScale+™ MPSoC EG

 

Package Tray

 

Product Status Active

 

Architecture MPU, FPGA

 

Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

 

Flash Size -

 

RAM Size 1.8MB

 

Peripherals DMA, WDT

 

Connectivity CANbus, I²C, SPI, UART/USART, USB

 

Speed 500MHz, 1.2GHz

 

Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

 

Operating Temperature -40°C ~ 100°C (TJ)

 

Package / Case 784-BFBGA, FCBGA

 

Supplier Device Package 784-FCBGA (23×23)

 

Number of I/O 128

 

Base Product Number XAZU3

 

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Documents & Media

RESOURCE TYPE LINK
Datasheets XA Zynq UltraScale+ MPSoC Overview
Environmental Information Xilinx REACH211 Cert

Xiliinx RoHS Cert

HTML Datasheet XA Zynq UltraScale+ MPSoC Overview
EDA Models XAZU3EG-1SFVC784I by Ultra Librarian

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

system-on-chip (SoC)

system on a chip or system-on-chip (SoC) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memory interfaces, on-chip input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.[1] It may contain digitalanalogmixed-signal, and often radio frequency signal processing functions (otherwise it is considered only an application processor).

Higher-performance SoCs are often paired with dedicated and physically separate memory and secondary storage (such as LPDDR and eUFS or eMMC, respectively) chips, that may be layered on top of the SoC in what’s known as a package on package (PoP) configuration, or be placed close to the SoC. Additionally, SoCs may use separate wireless modems.[2]

SoCs are in contrast to the common traditional motherboard-based PC architecture, which separates components based on function and connects them through a central interfacing circuit board.[nb 1] Whereas a motherboard houses and connects detachable or replaceable components, SoCs integrate all of these components into a single integrated circuit. An SoC will typically integrate a CPU, graphics and memory interfaces,[nb 2] secondary storage and USB connectivity,[nb 3] random-access and read-only memories and secondary storage and/or their controllers on a single circuit die, whereas a motherboard would connect these modules as discrete components or expansion cards.

An SoC integrates a microcontrollermicroprocessor or perhaps several processor cores with peripherals like a GPUWi-Fi and cellular network radio modems, and/or one or more coprocessors. Similar to how a microcontroller integrates a microprocessor with peripheral circuits and memory, an SoC can be seen as integrating a microcontroller with even more advanced peripheralsFor an overview of integrating system components, see system integration.

More tightly integrated computer system designs improve performance and reduce power consumption as well as semiconductor die area than multi-chip designs with equivalent functionality. This comes at the cost of reduced replaceability of components. By definition, SoC designs are fully or nearly fully integrated across different component modules. For these reasons, there has been a general trend towards tighter integration of components in the computer hardware industry, in part due to the influence of SoCs and lessons learned from the mobile and embedded computing markets. SoCs can be viewed as part of a larger trend towards embedded computing and hardware acceleration.

SoCs are very common in the mobile computing (such as in smartphones and tablet computers) and edge computing markets.[3][4] They are also commonly used in embedded systems such as WiFi routers and the Internet of things.

Types

In general, there are three distinguishable types of SoCs:

Applications[edit]

SoCs can be applied to any computing task. However, they are typically used in mobile computing such as tablets, smartphones, smartwatches and netbooks as well as embedded systems and in applications where previously microcontrollers would be used.

Embedded systems[edit]

Where previously only microcontrollers could be used, SoCs are rising to prominence in the embedded systems market. Tighter system integration offers better reliability and mean time between failure, and SoCs offer more advanced functionality and computing power than microcontrollers.[5] Applications include AI acceleration, embedded machine vision,[6] data collectiontelemetryvector processing and ambient intelligence. Often embedded SoCs target the internet of thingsindustrial internet of things and edge computing markets.

Mobile computing[edit]

Mobile computing based SoCs always bundle processors, memories, on-chip cacheswireless networking capabilities and often digital camera hardware and firmware. With increasing memory sizes, high end SoCs will often have no memory and flash storage and instead, the memory and flash memory will be placed right next to, or above (package on package), the SoC.[7] Some examples of mobile computing SoCs include:


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