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Manufacturer of Sound Processor Ic - DS90UB936TRGZTQ1 S VQFN-64 UB947Q Interface IC chip – Yingnuode

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Manufacturer of Sound Processor Ic - DS90UB936TRGZTQ1 S VQFN-64 UB947Q Interface IC chip – Yingnuode Detail:

Product Attributes

TYPE DESCRIPTION
Category Integrated Circuits (ICs)
  Interface – Serializers, Deserializers
Mfr Texas Instruments
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
  Cut Tape (CT)
Part Status Active
Function Serializer
Data Rate 3.36Gbps
Input Type LVDS
Output Type FPD-Link III, LVDS
Number of Inputs 8
Number of Outputs 2
Voltage – Supply 1.71V ~ 1.89V
Operating Temperature below zero 40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 64-VFQFN Exposed Pad
Supplier Device Package 64-VQFN (9×9)
Base Product Number DS90UB947

Integrated Circuit Type

Conversion of information formats, such as serial and parallel conversion;

Ability to reconcile type and level differences between CPUS and peripherals in information.  For example, horizontal conversion drivers, d/A or A/D converters, etc;

Reconciling temporal differences

Address decoding and selection function

Set up the interrupt and DMA control logic to ensure that the interrupt and DMA request signals are generated with DMA permission, and that interrupt processing and DMA transfer are completed after the interrupt and DMA reply are accepted.

An input/output interface is an electronic circuit, usually an IC chip or interface board, consisting of special registers and corresponding control logic circuits.  It is the medium and bridge for information exchange between the CPU and input/output devices.  The CONNECTION between CPU and external devices, memory and data exchange need to be completed through an interface device, the former is called I/O interface, the latter is called memory interface.  Memory is generally synchronous control by CPU, interface circuit is relatively simple;  The interface circuit varies according to the type of I/O device, so an interface is conventionally referred to as an I/O interface.  There are mainly the following I/O interface hardware

There are two integration methods for silicon-based photonic devices and CMOS circuits.

The advantage of the former is that the photonic devices and electronic devices can be optimized separately, but the subsequent packaging is difficult and commercial applications are limited. The latter is difficult to design and process integration of the two devices.  At present, hybrid assembly based on nuclear particle integration is the best choice

Eg 1.Input/output interface chip

Most chips are integrated circuits, they input different instructions and parameters through the CPU, and control the relevant I/O circuit and simple external devices for corresponding operations, common interface chips have timing/counter, interrupt controller, DMA controller, parallel interface and so on.

Eg 2. Input/output interface control card

Depending on some logic, several integrated circuits may become one part, either directly connected to the CPU, or plug-ins may be inserted into slots on the system.


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