The 3rd Generation Semiconductor Forum 2022 will be held in Suzhou on December 28th!
Semiconductor CMP Materials and Targets Symposium 2022 will be held in Suzhou on December 29th!
According to McLaren’s official website, they recently added an OEM customer, the American hybrid sports car brand Czinger, and will provide the next generation IPG5 800V silicon carbide inverter for the customer’s 21C supercar, which is expected to start delivery next year.
According to the report, the Czinger hybrid sports car 21C will be equipped with three IPG5 inverters, and the peak output will reach 1250 horsepower (932 kW).
Weighing less than 1,500 kilograms, the sports car will be equipped with a 2.9-litre twin-turbocharged V8 engine that revs over 11,000 rpm and accelerates from 0 to 250 mph in 27 seconds, in addition to the silicon carbide electric drive.
On December 7, Dana’s official website announced that they have signed a long-term supply agreement with SEMIKRON Danfoss to secure the production capacity of silicon carbide semiconductors.
It is reported that Dana will use SEMIKRON’s eMPack silicon carbide module and has developed medium and high voltage inverters.
On February 18 this year, SEMIKRON’s official website said that they had signed a contract with a German automaker for a 10+ billion euros (more than 10 billion yuan) silicon carbide inverter.
SEMIKRON was founded in 1951 as a German manufacturer of power modules and systems. It is reported that this time the German car company ordered SEMIKRON’s new power module platform eMPack®. The eMPack® power module platform is optimized for silicon carbide technology and uses fully sintered “direct pressure mold” (DPD) technology, with volume production scheduled to begin in 2025.
Dana Incorporated is an American automotive Tier1 supplier founded in 1904 and headquartered in Maumee, Ohio, with sales of $8.9 billion in 2021.
On December 9, 2019, Dana presented its SiC inverterTM4, which can supply more than 800 volts for passenger cars and 900 volts for racing cars. Moreover, the inverter has a power density of 195 kilowatts per liter, nearly double the US Department of Energy’s 2025 target.
Regarding the signing,Dana CTO Christophe Dominiak said: Our electrification program is growing, we have a large order backlog ($350 million in 2021), and inverters are critical. This multi-year supply agreement with Semichondanfoss provides us with a strategic advantage by ensuring access to SIC semiconductors.
As the core materials of emerging strategic industries such as next-generation communications, new energy vehicles, and high-speed trains, the third-generation semiconductors represented by silicon carbide and gallium nitride are listed as key points in the “14th Five-Year Plan” and the outline of long-term goals for 2035.
Silicon carbide 6-inch wafer production capacity is in a period of rapid expansion, while leading manufacturers represented by Wolfspeed and STMicroelectronics have reached the production of 8-inch silicon carbide wafers. Domestic manufacturers such as Sanan, Shandong Tianyue, Tianke Heda and other manufacturers mainly focus on 6-inch wafers, with more than 20 related projects and an investment of more than 30 billion yuan; Domestic 8-inch wafer technology breakthroughs are also catching up. Thanks to the development of electric vehicles and charging infrastructure, the market growth rate of silicon carbide devices is expected to reach 30% between 2022 and 2025. Substrates will remain the main capacity limiting factor for silicon carbide devices in the coming years.
GaN devices are currently primarily driven by the fast-charging power market and the 5G macro base station and millimeter wave small cell RF markets. The GaN RF market is mainly occupied by Macom, Intel, etc., and the power market includes Infineon, Transphorm and so on. In recent years, domestic enterprises such as Sanan, Innosec, Haiwei Huaxin, etc. are also actively deploying gallium nitride projects. In addition, gallium nitride laser devices have developed rapidly. GaN semiconductor lasers are used in lithography, storage, military, medical and other fields, with annual shipments of about 300 million units and recent growth rates of 20%, and the total market is expected to reach $1.5 billion in 2026.
The 3rd Generation Semiconductor Forum will be held on December 28, 2022. A number of leading enterprises at home and abroad participated in the conference, focusing on the upstream and downstream industrial chains of silicon carbide and gallium nitride; The latest substrate, epitaxy, device processing technology and production technology; The research progress of cutting-edge technologies of wide bandgap semiconductors such as gallium oxide, aluminum nitride, diamond, and zinc oxide is prospected.
The subject of the meeting
1. The impact of the US chip ban on the development of China’s third-generation semiconductors
2. Global and Chinese third-generation semiconductor market and industry development status
3. Wafer capacity supply and demand and third-generation semiconductor market opportunities
4. Investment and market demand outlook for 6-inch SiC projects
5. Status quo and development of SiC PVT growth technology & liquid phase method
6. 8-inch SiC localization process and technological breakthrough
7. SiC market and technology development problems & solutions
8. Application of GaN RF devices and modules in 5G base stations
9. Development and substitution of GaN in the quick-charging market
10. GaN laser device technology and market application
11. Opportunities and challenges for localization and technology and equipment development
12. Other third-generation semiconductor development prospects
Chemical mechanical polishing (CMP) is a key process for achieving global wafer flattening. The CMP process runs through silicon wafer manufacturing, integrated circuit manufacturing, packaging and testing. Polishing fluid and polishing pad are the core consumables of the CMP process, accounting for more than 80% of the CMP material market. CMP material and equipment enterprises represented by Dinglong Co., Ltd. and Huahai Qingke have received close attention from the industry.
The target material is the core raw material for the preparation of functional films, which are mainly used in semiconductors, panels, photovoltaics and other fields to achieve conductive or blocking functions. Among the major semiconductor materials, the target material is the most domestically produced. Domestic aluminum, copper, molybdenum and other target materials have made breakthroughs, the main listed companies include Jiangfeng Electronics, Youyan New Materials, Ashitron, Longhua Technology and so on.
The next three years will be a period of rapid development of China’s semiconductor manufacturing industry, SMIC, Huahong Hongli, Changjiang Storage, Changxin Storage, Silan Micro and other enterprises to accelerate the expansion of production, Gekewei, Dingtai Craftsman, China Resources Micro and other enterprises layout of 12-inch wafer production lines will also be put into production, which will bring huge demand for CMP materials and target materials.
Under the new situation, the security of the domestic fab supply chain is becoming more and more important, and it is imperative to cultivate stable local material suppliers, which will also bring huge opportunities to domestic suppliers. The successful experience of target materials will also provide reference for the localization development of other materials.
The Semiconductor CMP Materials and Targets Symposium 2022 will be held in Suzhou on December 29. The conference was hosted by Asiacchem Consulting, with the participation of many domestic and foreign leading enterprises.
The subject of the meeting
1. China’s CMP materials and target material policy and market trends
2. The impact of U.S. sanctions on the domestic semiconductor material supply chain
3. CMP material and target market and key enterprise analysis
4. Semiconductor CMP polishing slurry
5. CMP polishing pad with cleaning liquid
6. Progress of CMP polishing equipment
7. Semiconductor target market supply and demand
8. Trends of key semiconductor target enterprises
9. Progress in CMP and target technology
10. Experience and reference of localization of target materials
Post time: Jan-03-2023