Integrated development of integrated circuit chip and electronic integrated package
Due to the I/O simulator and bump spacing is difficult to reduce with the development of IC technology, trying to push this field to a higher level AMD will adopt advanced 7Nm technology, in 2020 launched in the second generation of integrated architecture to become the main computing core, and in I/O and memory interface chips using mature technology generation and IP, To ensure that the latest second generation core integration based on infinite exchange with higher performance, thanks to the chip – interconnection and integration of collaborative design, the improvement of packaging system management (clock, power supply, and the encapsulation layer, the 2.5 D integration platform successfully achieve the expected goals, opens a new route for the development of advanced server processors